ECX-6273-50.000M
RoHS
Pb
PLEASE NOTE:
Due to the inherent proprietary nature of custom part numbers, certain parameters
are intentionally excluded from this specification sheet.
ECX-6273 -50.000M
Series
Ecliptek Custom Crystal
Nominal Frequency
50.000MHz
ELECTRICAL SPECIFICATIONS
Nominal Frequency
50.000MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
High Temperature Storage
Low Temperature Storage
Mechanical Shock
Moisture Resistance
Solder Thermal Stability
Thermal Shock
Vibration
JIS C 6701 10.6 Leak Rate: 2.1 x 10
-9
Pa-m
3
/6 Maximum
JIS C 6701 10.6 Leak Rate: 1.27 x 10
-5
Pa-m
3
/8 Maximum
JIS C 7021 B-10: at 85°C for 1000 Hours
JIS C 7021 B-12: at -40°C for 1000 Hours
Random Drop on Rigid Hard Wood Surface 3 Times at Height of 75cm
JIS C 7021 B-11: at 85°C and 90% Humidity for 1000 Hours
Recommended Reflow Temperature Profile 1 Time
100 Cycles over -40°C to +85°C for 30 Minutes
JIS C 6701 10.26: at 10Hz to 55Hz, 1.5mm Amplitude for 1 Minute. Test Time: X, Y, Z Each Direction for 2
Hours.
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
2.50
±0.10
MARKING
ORIENTATION
1.00 ±0.10
4
1
1.20
±0.10
3
2
0.75 ±0.10
(X4)
2
1.00
±0.10
(X4)
3
4
LINE MARKING
1
2
ECX
6273
3.20
±0.10
0.70 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4
ECX-6273-50.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.3 (X4)
1.3 (X4)
0.8
Solder Land
(X4)
0.4
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4
ECX-6273-50.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4
ECX-6273-50.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 245°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4
